Schippers & Crew, Inc.









	Schippers & Crew is achieving flawless BGA placement results thanks to our state-of-the-art Conceptronic Freedom 3000 BGA/SMT rework machine; the HVA-102 seven zone reflow ovens; and our Dage XD7600 X-Ray inspection system. Our first year of BGA production saw more than 1100 placements without a single error! Schippers & Crew sets the standard of quality for BGA placement with a 100% error free placement record! More Data on BGAs: Ball Grid Array packages are unique in that instead of using leads exiting the edge of the component package for attachment to printed wiring boards, as is the case with QFPs (Quad Flat Packs), a matrix of metal balls (spheres) are attached to the underside of the component package. The BGA package provides high interconnection density at a low cost while providing improved electrical performance in a reduced package size compared to other technologies of similar I/O. As the popularity of BGA devices continues to grow, process capability of manufacturing equipment -such as component placement, reflow soldering, x-ray and rework equipment - become critical tools for successful implementation. While much of the allure for BGA packaging has been defined as a “drop in” to current assembly processes, it is becoming obvious that the BGA is not one or even a few package types but a class of packages that are ever-expanding in many form factors. The vision we have at Schippers and Crew is not to select entry-level systems with minimal benefits but to select equipment based on functionality, versatility and integration that provide outstanding performance as well as a springboard to adjacent technologies. Two recent acquisitions of equipment provide Schippers & Crew the ability to support implementation of BGA processes while enhancing current and future manufacturing capability. • Conceptronic, HVA 102, seven zone reflow soldering system. • Conceptronic, Freedom 3000, BGA/SMT rework system. • Dage, XD7600 X-Ray Inspection System Schippers & Crew will continue to address future process/technology requirements, selecting new equipment to provide growth while enhancing the value of our services.